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1812 自恢复贴片保险丝

							Features ■ Surface Mount Devices ■ Lead free device ■ Surface Mount packaging for automated assembly ■ Agency recognition: UL										Applications Almost anywhere there is a low voltage power supply, up to 60V and a load to be protected, including: ■ Computer mother board, Modem. USB hub ■ PDAs & Charger, Analog & digital line card ■ Digital cameras, Disk drivers, CD-ROMs,
SMD 1812 SERIES							ROHS&RICH																FU YUAN
MODEL	MARKING			Vmax			Imax			Ihold		Itrip					Pd			Maximum Time To Trip							Resistance
				(Vdc)			(A)			@25°C (A)		@25°C (A)					Max. (W)			Current (A)				Time (Sec)			Rimin (Ω)			R1max (Ω)
mSMD010				30.0			100			0.10		0.30					0.8			0.5				1.50			0.750			15.000
mSMD014				33.0			100			0.14		0.34					0.8			1.5				0.15			0.650			6.000
mSMD020				30.0			100			0.20		0.40					0.8			8.0				0.02			0.350			5.000
mSMD030				30.0			100			0.30		0.60					0.8			8.0				0.10			0.250			3.000
mSMD050				15.0			100			0.50		1.00					0.8			8.0				0.15			0.150			1.000
mSMD075				13.2			100			0.75		1.50					0.8			8.0				0.20			0.090			0.450
mSMD110				8.0			100			1.10		2.20					0.8			8.0				0.30			0.050			0.250
mSMD110-16V				16.0			100			1.10		2.20					0.8			8.0				0.30			0.050			0.250
mSMD125				16.0			100			1.25		2.50					0.8			8.0				0.40			0.050			0.140
mSMD150				8.0			100			1.50		3.00					0.8			8.0				0.50			0.040			0.160
mSMD150-16V				16.0			100			1.50		3.00					0.8			8.0				0.50			0.040			0.160
mSMD160				8.0			100			1.60		2.80					0.8			8.0				1.00			0.030			0.130
mSMD200				8.0			100			2.00		4.00					0.8			8.0				2.00			0.020			0.100
mSMD260				8.0			100			2.60		5.00					0.8			8.0				2.50			0.015			0.050
mSMD300				8.0			100			3.00		5.00					0.8			8.0				4.0			0.012			0.040
Ihold = Hold Current. Maximum current device will not trip in 25°C still air. Itrip = Trip Current. Minimum current at which the device will always trip in 25°C still air. Vmax = Maximum operating voltage device can withstand without damage at rated current (Imax). Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax). Pd = Maximum power dissipation when device is in the tripped state in 25°C still air environment at rated voltage. Rimin/max = Minimum/Maximum device resistance prior to tripping at 25°C. R1max = Maximum device resistance is measured one hour post reflow. CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.
Environmental Specifications
Test		Conditions														Resistance change
Passive aging		+85°C, 1000 hrs.														±5% typical
Humidity aging		+85°C, 85% R.H. , 168 hours														±5% typical
Thermal shock		+85°C to -40°C, 20 times														±33% typical
Resistance to solvent		MIL-STD-202,Method 215														No change
Vibration		MIL-STD-202,Method 201														No change
Ambient operating conditions : - 40 °C to 85 °C
Maximum surface temperature of the device in the tripped state is 125 °C
AGENCY APPROVALS : U.L approved
Ihold versus temperature
MODEL			Maximum ambient operating temperature (Tmao) vs. hold current (Ihold)
			-40°C		-20°C			0°C			25°C				40°C				50°C			60°C				70°C			85°C
mSMD010			0.16		0.14			0.12			0.11				0.08				0.07			0.06				0.05			0.03
mSMD014			0.23		0.19			0.17			0.14				0.12				0.10			0.09				0.08			0.06
mSMD020			0.29		0.26			0.23			0.20				0.17				0.15			0.14				0.12			0.10
mSMD030			0.44		0.39			0.35			0.30				0.26				0.23			0.21				0.18			0.15
mSMD050			0.59		0.57			0.55			0.50				0.45				0.43			0.35				0.30			0.23
mSMD075			1.10		0.99			0.87			0.75				0.63				0.57			0.49				0.45			0.35
mSMD110			1.60		1.45			1.28			1.10				0.92				0.83			0.71				0.66			0.52
Msmd125			2.00		1.75			1.52			1.25				1.00				0.95			0.90				0.75			0.53
mSMD150			2.30		2.05			1.77			1.50				1.23				1.09			0.95				0.82			0.61
mSMD200			2.88		2.61			2.25			2.00				1.80				1.66			1.45				1.39			1.19
Construction and Dimension (Unit:mm)
MODEL			A						B									C							D			E
			Min.			Max.			Min.				Max.					Min.			Max.				Min.			Min.
mSMD010			4.37			4.73			3.07				3.41					0.50			1.00				0.30			0.25
mSMD014			4.37			4.73			3.07				3.41					0.50			1.00				0.30			0.25
mSMD020			4.37			4.73			3.07				3.41					0.50			1.00				0.30			0.25
mSMD030			4.37			4.73			3.07				3.41					0.50			1.00				0.30			0.25
mSMD050			4.37			4.73			3.07				3.41					0.27			0.65				0.30			0.25
mSMD075			4.37			4.73			3.07				3.41					0.27			0.65				0.30			0.25
mSMD110			4.37			4.73			3.07				3.41					0.27			0.65				0.30			0.25
mSMD110-16V			4.37			4.73			3.07				3.41					0.27			0.65				0.30			0.25
mSMD125			4.37			4.73			3.07				3.41					0.27			0.65				0.30			0.25
mSMD150			4.37			4.73			3.07				3.41					0.27			0.65				0.30			0.25
mSMD150-16V			4.37			4.73			3.07				3.41					0.27			0.65				0.30			0.25
mSMD160			4.37			4.73			3.07				3.41					0.27			0.65				0.30			0.25
mSMD200			4.37			4.73			3.07				3.41					0.50			1.10				0.30			0.25
mSMD260			4.37			4.73			3.07				3.41					0.50			1.80				0.30			0.25

Termination pad characteristics Terminal pad materials： Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper Terminal pad solderability： Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3. Rework Use standard industry practices, the removal device must be replaced with a fresh one.
Thermal derating curve														Typical time-to-trip at 25°C
!WARNING · Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame. · PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when repeatedfault conditions or prolonged trip events are anticipated. · Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, andmechanical procedures for electronic components. · Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC. · Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space. · Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance of thedevices. PPTC SMD can be cleaned by standard methods. · Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper board layouts orreflow profile could negatively impact solderability performance of our devices.
														‧Recommended reflow methods：IR, vapor phase oven, hot air oven. ‧Devices are not designed to be wave soldered to the bottom sideof the board. ‧Recommended maximum paste thickness is 0.25 mm (0.010 inch). ‧Devices can be cleaned using standard method and solvents. Note：If reflow temperatures exceed the recommended profile,devices may not meet the performance requirements.
Tape and reel specifications (mm) Governing Specifications EIA 481-1
W	12 ± 0.3
P0	4.0 ± 0.10
P1	8.0 ± 0.10
P2	2.0 ± 0.05
A0	3.5 ± 0.10
B0	5.1 ± 0.10
B1max.	5.9
D0	1.5 + 0.1, -0
F	5.5 ± 0.05
E1	1.75 ± 0.10
E2min.	10.25
T	0.6
T1max.	0.1
K0	0.90±0.1
Leadermin.	390
Trailermin.	160
Reel Dimensions
A max.	178
N min.	60
W1	12.4 ± 0.5
‧ Storage conditions：40°C max, 70% R.H. ‧ Devices may not meet specified performanc if storage conditions are exceeded.
Order information Packaging SMD1812 110 SMD：surface mount device Current 1.1A Tape & Reel Quantity 1500/2000 pcs/reel

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