Performance Specification
|
Model |
|
|
|
|
|
|
Maximum |
Resistance |
||
|
|
V max |
Imax |
I hold |
I trip |
Pd |
Time To Trip |
||||
|
Marking |
|
|
@25°C |
@25°C |
Typ. |
Current |
Time |
R i min |
R1max |
|
|
|
(V dc) |
(A) |
(A) |
(A) |
(W) |
(A) |
(Sec) |
(W) |
(W) |
|
|
SMD2018-030SF |
030 |
60 |
10 |
0.30 |
0.60 |
0.9 |
1.5 |
3.00 |
0.500 |
2.300 |
|
SMD2018-050SF |
050 |
60 |
10 |
0.55 |
1.20 |
1.0 |
2.5 |
3.00 |
0.200 |
1.000 |
|
SMD2018-075SF |
075 |
60 |
10 |
0.75 |
1.50 |
1.1 |
8.0 |
0.30 |
0.110 |
0.630 |
|
SMD2018-100SF |
100 |
15 |
35 |
1.10 |
2.20 |
1.1 |
8.0 |
0.40 |
0.060 |
0.360 |
|
SMD2018-100SF33V |
100 |
33 |
35 |
1.10 |
2.20 |
1.1 |
8.0 |
0.40 |
0.060 |
0.360 |
|
SMD2018-150SF |
150 |
15 |
35 |
1.50 |
3.00 |
1.1 |
8.0 |
0.80 |
0.050 |
0.170 |
|
SMD2018-200SF |
200 |
10 |
35 |
2.00 |
4.00 |
1.1 |
8.0 |
2.40 |
0.030 |
0.100 |
V max = Maximum operating voltage device can withstand without damage at rated current (Imax).
I max = Maximum fault current device can withstand without damage at rated voltage (V max).
I hold = Hold Current. Maximum current device will not trip in 25°C still air.
I trip = Trip Current. Minimum current at which the device will always trip in 25°C still air.
Pd = Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
Ri min/max = Minimum/Maximum device resistance prior to tripping at 25°C.
R1max = Maximum device resistance is measured one hour post reflow.
CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.
Environmental Specifications
|
Test |
|
|
|
Conditions |
|
|
|
Resistance change |
|
|
|
Passive aging |
|
|
|
+85°C, 1000 hrs. |
|
|
I HOLD/I TRIP PASS |
|
|
|
|
Humidity aging |
|
|
|
+85°C, 85% R.H. , 168 hours |
|
I HOLD/I TRIP PASS |
|
|
||
|
Thermal shock |
|
|
|
+85°C to -40°C, 20 times |
|
|
I HOLD/I TRIP PASS |
|
||
|
Resistance to solvent |
|
|
|
MIL-STD-202,Method 215 |
|
|
电阻不變化 |
|
|
|
|
Vibration |
|
|
|
MIL-STD-202,Method 201 |
|
|
电阻不變化 |
|
|
|
|
Ambient operating conditions : - 40 °C to +85 °C |
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|
Maximum surface temperature of the device in the tripped state is 125 °C |
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Thermal Derading Chart
Recommended Hold Current(A) at Ambient Temperature(°C)
|
Model |
Ambient Operation Temperature |
||||||||
|
-40°C |
-20°C |
0°C |
25°C |
40°C |
50°C |
60°C |
70°C |
85°C |
|
|
SMD2018-030SF |
0.48 |
0.42 |
0.35 |
0.30 |
0.24 |
0.21 |
0.17 |
0.15 |
0.10 |
|
SMD2018-050SF |
0.87 |
0.77 |
0.67 |
0.55 |
0.46 |
0.41 |
0.36 |
0.31 |
0.23 |
|
SMD2018-075SF |
1.19 |
1.05 |
0.91 |
0.75 |
0.61 |
0.54 |
0.47 |
0.41 |
0.32 |
|
SMD2018-100SF |
1.71 |
1.52 |
1.32 |
1.10 |
0.94 |
0.84 |
0.74 |
0.64 |
0.50 |
|
SMD2018-150SF |
2.38 |
2.10 |
1.82 |
1.50 |
1.27 |
1.13 |
0.99 |
0.85 |
0.64 |
|
SMD2018-200SF |
2.95 |
2.65 |
2.35 |
2.00 |
1.74 |
1.59 |
1.44 |
1.29 |
1.06 |
Thermal Derating Curve
Average Time-Current Curve
Soldering Parameters
|
Profile Feature |
Pb-Free Assembly |
|
Average Ramp-Up Rate(Ts max to T p) |
3℃/second mac. |
|
Preheat -Temperature Min(Ts min) -Temperature Max(Ts max) -Time(Ts min to Ts max) |
150℃ 200℃ 60~180 seconds |
|
Time maintained above: -Temperature(TL) -Time(tL) |
217℃ 60~150 seconds |
|
Peak Temperature(Tp) |
260℃ |
|
Ramp-Down Rate |
6℃/second max. |
|
Time 25℃ to Peak Temperature |
8 minutes max |
|
Storage Condition |
0℃~30℃,30%~60%RH |
Recommended maximum paste thickness is 0.25mm
Devices can be cleaned using standard industry methods and solvents.
Note 1:All temperature refer to topside of the package, measured on the package body surface.
Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
Physical Dimensions(mm.)
|
Model |
A |
B |
C |
D |
E |
|||
|
Min. |
Max. |
Min. |
Max. |
Min. |
Max. |
Min. |
Min. |
|
|
SMD2018- |
4.72 |
5.44 |
4.22 |
4.93 |
0.50 |
1.20 |
0.30 |
0.25 |
Termination Pad Characteristics
Terminal pad materials：Tin-plated Nickel-Copper
Terminal pad solder ability：Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.
Recommended Pad Layout (mm.)
注：在此印锡面积条件下，推荐钢网厚度为≧0.12MM(钢网厚度不够要增大刷锡面积）
Packaging Quantity
|
Part Number |
Quantity |
|
SMD2018-0100SF33V |
2500 pcs/reel |
Tape & reel packaging per EIA481-1
Tape And Reel Specifications (mm)
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注意事项
PPTC使用注意事项：
·PPTC为热敏元件，对环境温度比较敏感，建议在PPTC周围不要设计热源元件，尽量减少外部热源的影响。
·请在规格书规定的参数下(<10%)使用，超出电压电流规格值，会导致PPTC出现电弧，阻值升高，甚至烧片。
·规格书的电气特性，均是基于在大容指定测试板经过一次回流焊之后的测试；如果客户有二次回流焊或者注塑点胶等其他热工序，会对上述参数有一定程度的衰减，需要验证其适用性。
·PPTC贴片产品是为SMT工艺设计的封装形式，焊接工艺为回流焊；要求客户遵守我们推荐的焊盘布局和回流焊配置文件。不正确的电路板布局或回流配置可能会对PPTC的可焊性性能产生负面影响。焊接工艺可参考大容推荐的回流焊曲线。如果回流焊温度超过推荐的值，PPTC将有可能受到损伤。使用手工焊及波峰焊接PPTC可能会导致产品焊后电阻超出规格。
·某些注塑料、单组份、双组份固化胶粘剂、硅胶、侵蚀性溶剂污染PPTC材料破坏芯片，需要对注塑料胶料等材料牌号以及应用参数（如温度、时间等）进行验证，以确保产品及工艺的匹配性，确认不会影响PPTC性能之后方可使用。PPTC在充电线端应用中，建议使用PP类材料做内膜，禁止使用TPE类与PVC类等材料做内膜。
·PPTC贴装或使用过程中，不建议使用洗板水或其他清洗剂进行清洗。如必须使用，需要验证各类清洗剂、洗板水以及溶剂的适用性，确认不会影响PPTC性能之后方可使用。已知对PPTC有影响的化学药品包括但不于醚类、苯类、酮类以及脂类等较强溶解性、破坏性的有机化合物，清洗后将产品放置于敞开的环境中至少24小时，将残留的溶剂进行充分的挥发。
·装配过程中，避免用暴力砸、挤、压、拉、扭、刺等方式作用PPTC本体，以免引起PPTC 性能衰减。
·PPTC元件是为电路中偶尔出现的过流而设计的，不建议用在连续且持续过流的电路中。
·大容SMD PPTC湿敏等级为2级，为密封包装。客户如在库存中发现有包装破损的，立即将产品隔离处理；使用时如有余料，需恢复之前包装状态，做密封保存，否则会影响产品性能导致焊后电阻越规格。
·产品废弃时，可按照一般电子废弃物处理，具体材料组成可参见MSDS
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