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0603贴片自恢复保险丝

发布时间:2019-08-10 14:08:52点击率:
0603贴片自恢复保险丝

Performance Specification                                                  

Model

Marking

Maximum

Resistance

认证

V max

Imax

I hold

I trip

Pd

Time To Trip

@25°C

@25°C

Typ.

Current

Time

R i min

R1max

UL

(V dc)

(A)

(A)

(A)

(W)

(A)

(Sec)

(W)

(W)

SMD0603R001SF

X

60

20

0.01

0.03

0.5

0.2

1.00

15.000

100.000

 

SMD0603R002SF

Y

60

20

0.02

0.06

0.5

0.2

1.00

12.000

70.000

 

SMD0603R002SF9v

Y

9

20

0.02

0.06

0.5

0.2

1.00

12.000

70.000

SMD0603R003SF

Z

30

20

0.03

0.09

0.5

0.2

1.00

6.000

50.000

 

SMD0603R003SF9v

Z

9

20

0.03

0.09

0.5

0.2

1.00

6.000

50.000

SMD0603R004SF

-

24.0

20

0.04

0.12

0.5

0.20

1.00

4.000

40.000

 

SMD0603R005SF

-

15.0

20

0.05

0.15

0.5

0.25

1.00

3.800

30.000

 

SMD0603R005SF9v

-

9.0

20

0.05

0.15

0.5

0.25

1.00

3.800

30.000

SMD0603R010SF

1

15.0

35

0.10

0.30

0.5

0.5

1.00

0.900

6.000

 

SMD0603R010SF9v

1

9.0

35

0.10

0.30

0.5

0.5

1.00

0.900

6.000

SMD0603R020SF

2

9.0

35

0.20

0.50

0.5

1.0

0.60

0.550

3.500

SMD0603R020SF16v

2

16.0

35

0.20

0.50

0.5

1.0

0.60

0.550

3.500

 

SMD0603R025SF

2

9.0

35

0.25

0.55

0.5

8.0

0.08

0.500

3.000

SMD0603R025SF16v

2

16.0

35

0.25

0.55

0.5

8.0

0.08

0.500

3.000

 

SMD0603R035SF

3

6.0

35

0.35

0.75

0.5

8.0

0.10

0.200

1.000

 

SMD0603R040SF

5

6.0

35

0.40

0.80

0.5

8.0

0.10

0.150

0.900

 

SMD0603R050SF

5

6.0

35

0.50

1.00

0.5

8.0

0.10

0.100

0.800

 

SMD0603R050SF12v

5

12.0

35

0.50

1.00

0.5

8.0

0.10

0.100

0.800

 

SMD0603R060SF

7

6.0

35

0.60

1.20

0.5

8.0

0.10

0.080

0.600

 

SMD0603R065SF

7

6.0

35

0.65

1.30

0.5

8.0

0.10

0.070

0.550

 

SMD0603R075SF

7

6.0

35

0.75

1.40

0.5

8.0

0.10

0.060

0.450

 

SMD0603R100SF

0

6.0

35

1.00

2.00

0.5

8.0

0.10

0.050

0.300

 

      V max  = Maximum operating voltage device can withstand without damage at rated current (Imax).

      I max   = Maximum fault current device can withstand without damage at rated voltage (V max).

      I hold   = Hold Current. Maximum current device will not trip in 25°C still air.

      I trip    = Trip Current. Minimum current at which the device will always trip in 25°C still air.

      Pd      = Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.

      Ri min/max  = Minimum/Maximum device resistance prior to tripping at 25°C.

      R1max  = Maximum device resistance is measured one hour post reflow.

      CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.

Environmental Specifications                                                

Test

 

 

 

Conditions

 

 

 

Resistance change

Passive aging

+85°C, 1000 hrs.

±5% typical

Humidity aging

+85°C, 85% R.H. , 168 hours

±5% typical

Thermal shock

+85°C to -40°C, 20 times

±33% typical

Resistance to solvent

MIL-STD-202,Method 215

No change

Vibration

MIL-STD-202,Method 201

No change

Ambient operating conditions : - 40 °C to +85 °C

Maximum surface temperature of the device in the tripped state is 125 °C


Thermal Derading Chart                                                   

      Recommended Hold Current(A) at Ambient Temperature(°C)

Model

Ambient Operation Temperature

-40°C

-20°C

0°C

25°C

40°C

50°C

60°C

70°C

85°C

SMD0603R001SF

0.016

0.014

0.012

0.010

0.008

0.007

0.006

0.005

0.0035

SMD0603R002SF

0.031

0.027

0.024

0.020

0.016

0.014

0.012

0.011

0.007

SMD0603R003SF

0.047

0.041

0.036

0.030

0.024

0.021

0.018

0.016

0.0108

SMD0603R004SF

0.052

0.048

0.044

0.040

0.032

0.028

0.024

0.020

0.012

SMD0603R005SF

0.065

0.060

0.055

0.050

0.040

0.035

0.031

0.025

0.015

SMD0603R010SF

0.13

0.12

0.11

0.10

0.08

0.07

0.06

0.05

0.03

SMD0603R020SF

0.27

0.25

0.23

0.20

0.17

0.14

0.12

0.10

0.07

SMD0603R025SF

0.32

0.29

0.27

0.25

0.21

0.18

0.16

0.14

0.10

SMD0603R035SF

0.47

0.41

0.38

0.35

0.29

0.26

0.24

0.20

0.14

SMD0603R040SF

0.54

0.47

0.43

0.40

0.33

0.29

0.27

0.22

0.16

SMD0603R050SF

0.67

0.59

0.54

0.50

0.41

0.37

0.34

0.29

0.20

SMD0603R060SF

0.81

0.70

0.651

0.60

0.49

0.44

0.41

0.34

0.24

SMD0603R065SF

0.87

0.76

0.71

0.65

0.54

0.48

0.44

0.37

0.26

SMD0603R075SF

0.98

0.85

0.81

0.75

0.60

0.54

0.44

0.40

0.31

SMD0603R100SF

1.19

1.13

1.08

1.00

0.80

0.72

0.59

0.54

0.43



Thermal Derating Curve                Average Time-Current Curve            

 

Soldering Parameters


Profile Feature

Pb-Free Assembly

Average Ramp-Up Rate(Ts max to T p)

3/second mac.

Preheat

  -Temperature Min(Ts min)

  -Temperature Max(Ts max)

  -Time(Ts min to Ts max)

 

150

200

60~180 seconds

Time maintained above:

  -Temperature(TL)

  -Time(tL)

 

217

60~150 seconds

Peak Temperature(Tp)

260

Ramp-Down Rate

6/second max.

Time 25 to Peak Temperature

8 minutes max

Storage Condition

0~35,30%-60%RH

           Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free

      Recommended maximum paste thickness is 0.25mm

      Devices can be cleaned using standard industry methods and solvents.

      Note 1:All temperature refer to topside of the package, measured on the package body surface.

      Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements

     

Physical Dimensions(mm.)                                                


         

 

 

 

型號

A

B

C

D

E

Min.

Max.

Min.

Max.

Min.

Max.

Min.

Min.

SMD0603R001SF

1.45

1.85

0.65

1.05

0.40

1.00

0.15

0.10

SMD0603R002SF9v

1.45

1.85

0.65

1.05

0.40

1.00

0.15

0.10

SMD0603R002SF

1.45

1.85

0.65

1.05

0.40

1.00

0.15

0.10

SMD0603R003SF9v

1.45

1.85

0.65

1.05

0.40

1.00

0.15

0.10

SMD0603R003SF

1.45

1.85

0.65

1.05

0.40

1.00

0.15

0.10

SMD0603R004SF

1.45

1.85

0.65

1.05

0.40

1.00

0.15

0.10

SMD0603R005SF9v

1.45

1.85

0.65

1.05

0.40

1.00

0.15

0.10

SMD0603R005SF

1.45

1.85

0.65

1.05

0.40

1.00

0.15

0.10

SMD0603R010SF9v

1.45

1.85

0.65

1.05

0.40

1.00

0.15

0.10

SMD0603R010SF

1.45

1.85

0.65

1.05

0.40

1.00

0.15

0.10

SMD0603R020SF

1.45

1.85

0.65

1.05

0.40

1.00

0.15

0.10

SMD0603R020SF16v

1.45

1.85

0.65

1.05

0.40

1.00

0.15

0.10

SMD0603R025SF

1.45

1.85

0.65

1.05

0.40

1.00

0.15

0.10

SMD0603R025SF16v

1.45

1.85

0.65

1.05

0.40

1.00

0.15

0.10

SMD0603R035SF

1.45

1.85

0.65

1.05

0.35

0.90

0.15

0.10

SMD0603R040SF

1.45

1.85

0.65

1.05

0.40

0.90

0.15

0.10

SMD0603R050SF

1.45

1.85

0.65

1.05

0.55

1.15

0.15

0.10

SMD0603R050SF12v

1.45

1.85

0.65

1.05

0.55

1.15

0.15

0.10

SMD0603R060SF

1.45

1.85

0.65

1.05

0.55

1.15

0.15

0.10

SMD0603R065SF

1.45

1.85

0.65

1.05

0.55

1.15

0.15

0.10

SMD0603R075SF

1.45

1.85

0.65

1.05

0.55

1.15

0.15

0.10

SMD0603R100SF

1.45

1.85

0.65

1.05

0.55

1.15

0.15

0.10

      Termination Pad Characteristics

      Terminal pad materials:Tin-plated Nickel-Copper

      Terminal pad solder ability:Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.

 

Recommended Pad Layout (mm.)     

                                    

 Packaging Quantity                                                      

Part Number

Quantity

SMD0603 HF Series

4,000 pcs/reel

     Tape & reel packaging per EIA481-1

 Tape And Reel Specifications (mm)                                         

Governing Specifications

EIA 481-1

W

8.0 ± 0.2

P0

4.0 ± 0.10

P1

4.0 ± 0.10

P2

2.0 ± 0.05

A0

1.05 ± 0.10

B0

1.85 ± 0.10

D0

1.55 + 0.05

F

3.5 ± 0.05

E1

1.75 ± 0.10

E2min.

6.25

T

0.20

T1max.

0.1

K0

0.75/0.95 ± 0.1

Leader min.

390

Trailer min.

160

卷軸規格

A max.

178

N min.

60

W1

9.0 ± 0.5

W2

12.0 ± 0.05

W

8.0 ± 0.2

 

 

Storage And Handling

Storage conditions35°C max, 30%-60% R.H.

Devices may not meet specified performance

  if storage conditions are exceeded.


 

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